![]() During the automated or human soldering process, outgassing in via holes causes blow holes, sunken solder fillets, and pin holes. One of the main goals of PCB baking is to prevent delamination or measling of the PCB by preventing moisture outgassing through copper plating in through holes. Measurements of weight increase and loss can be used to see if the moisture on the circuit board has evaporated. ![]() It is critical not to overheat the board or bake it for an extended period of time, as this can cause damage. The high temperature causes the moisture on the board to evaporate. In the PCB baking process, the PCB is placed in an oven set at a temperature of 100 to 110 ☌ (up to 130 ☌). Polyimide flex and stiff materials, for instance, can absorb more moisture than FR4 boards. The amount of moisture that a PCB absorbs is determined by the laminate material that was utilised in the PCB. ![]() If moisture remains on the PCB, it can develop into water vapor/steam and expand during various PCB processing phases, causing damage to the board or circuit failure. Moisture gets trapped in the printed circuit board or absorbed by the laminate material of the PCB as a result of this. ![]() Condensation can happen when the surface of a PCB is cooler than the air around it. PCB baking is a technique for removing moisture from a produced circuit board.
0 Comments
Leave a Reply. |
AuthorWrite something about yourself. No need to be fancy, just an overview. ArchivesCategories |